Helmet Mountable Timed Event RFID Tag Assembly And Method Of Use

ABSTRACT

An RFID tag assembly and method of use with a helmet wherein the RFID tag assembly the RFTD tag assembly includes an RFID tag having a mounting substrate with an exposed first planar surface and an opposing second planar surface, the RFID tag having an RFID semiconductor chip has a predetermined operating frequency with an antenna interface mounted on the second planar surface, a conductor electrically coupled to the antenna interface of the RFID semiconductor chip, and an antenna electrically coupled to the conductor. A spacer has a first surface and an opposing second surface. The first surface of the spacer is attached to the second planar surface of the RFID tag. The spacer has a predetermined thickness between the first surface and the second surface. A mounting carrier has a substantially planar body with a first portion having a first end and a second end with two sides defined therebetween and has one or more second portions extending from the body forming free ends each with a planar top surface and a planar bottom surface, with selectively attachable adhesive on a portion of the bottom surface being deformably attached to the first portion. The second surface of the spacer is attached to the top surface of the first portion with the first planar surface of the RFID tag position parallel and set apart above the top surface of the carrier by a distance equal to or greater than the predetermined thickness of the spacer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.61/434,723, filed on Jan. 20, 2011 entitled ARTICLE AND METHOD OF AHELMET MOUNTABLE RFID TAG FOR A TIMED EVENT, the disclosure of which isincorporated herein by reference.

FIELD

The present disclosure relates radio frequency identification (“RFID”)tags and, more specifically, to a helmet mountable event participantRFID timing chip.

BACKGROUND

The statements in this section merely provide background informationrelated to the present disclosure and may not constitute prior art.

One of the greatest challenges in reading RFID tags that are placed on asurface of a moving object in a timed event such as a race, wherein suchobject surface absorbs RF energy as utilized by the RFID tag. When anRFID tag is placed near a medium that absorbs RF energy, the operationalability and/or operating range of the RFID tag can be negativelyimpacted. For example, an RFID tag placed on or in close proximity tothe human body of the event participant is subject to the interaction ofthe RF signal to and from the RFID tag and the negative impacts of thebody on such RF signals. The RF signal strength received by ortransmitted from the RFID tag can be reduced by water or other foreignmaterials such as dirt or mud that comes in contact with, or in veryclose proximity to, an RFID tag, or the body of the participant inproximity to the RFID tag. RF absorption from an RFID tag placed inproximity to a human body or on or near a vehicle can significantlylimit the operation of the RFID tag, and thereby negatively impact theability for an RFID tag reader to effectively and accurately read thetag of the participant for identifying the participant and making adetermination of the participants time of passing an event detectionpoint.

In addition, RFID tags are often not contained in rigid or protectedenclosures. Thus, damage can easily occur to an RFID tag that willaffect its ability to communicate properly. All or some of theseconditions can prevent an RFID tag from providing a high level of readaccuracy in a harsh environment, such as at a sporting event.

SUMMARY

The inventor hereof has identified the need and advantages of providingan assembly for an RFID tag having an extended tag operating range thatfunctions well when positioned in close proximity to a moving eventparticipant wearing a helmet, such a bicycle or motorcycle or anysimilar event wherein tracking and/or locating the participant using anRFID chip is desired. The is particular useful when structures are nearto the RFID chip that inherently absorb RF energy and/or that isconfigured to operate in a variety of operating environments includingthose that may be harsh. The inventor hereof has succeeded at designingassemblies and methods for operating an RFID tag that is capable of usein such operating environments with easy placement on a participant'shelmet during the event.

According to one aspect, an RFID tag assembly for use in tracking ortiming of the progress of a user wearing a helmet is disclosed. The RFIDtag assembly includes a mounting substrate with an exposed first planarsurface and an opposing second planar surface. The RFID tag has an RFIDsemiconductor chip having a predetermined operating frequency with anantenna interface mounted on the second planar surface, a conductorelectrically coupled to the antenna interface of the RFID semiconductorchip, and an antenna electrically coupled to the conductor. A mountingcarrier provides for attachment to an outer portion of the helmet. Themounting carrier has a first portion having an upper surface and a lowersurface and at least one second portion pivotally coupled to the firstportion. At least one free end extends from the first portion and has anupper surface and a lower surface. The second planar surface of the RFIDtag is fixedly attached to the upper surface of the first portion. Eachsecond portion is selectably deformable in relation to the pivotallycoupled first portion and has a selectively attachable adhesive on thebottom surface of at least a portion of the extending second portion. Aspacer has a first surface and an opposing second surface with apredetermined thickness between the first surface and the secondsurface. The second planar surface of the RFID tag is fixedly attachedvia the first surface of the spacer being attached to the second planarsurface of the RFID tag and the second surface of the spacer beingattached to the upper surface of the first portion of the mountingcarrier.

According to another aspect, a method of operating a radio frequencyidentification (RFID) tag assembly as described in the immediatepreceding paragraph, includes attaching the described RFID tag assemblyto an operating surface of a piece of equipment used by an eventparticipant, the operating surface of the equipment piece having anouter surface and an inner surface and one or more openings extendingthrough the outer surface towards the inner surface and defining anintermediate surface therebetween. The method also includes orienting afirst portion of the RFID tag assembly along the outer surface of theoperating surface, and folding at least one second portion along a foldline between the first portion and second portion of the RFID tagassembly. The method further includes threading the at least one secondportion of the RFID tag assembly through one of openings from the outersurface proximate towards the inner surface and selectively securing theat least one second portion of the RFID tag assembly to at least one ofthe intermediate surface and the inner surface of the operating surfaceof the piece of equipment.

According to yet another aspect, the RFID tag assembly includes an RFIDtag having a mounting substrate with an exposed first planar surface andan opposing second planar surface, the RFID tag having an RFIDsemiconductor chip has a predetermined operating frequency with anantenna interface mounted on the second planar surface, a conductorelectrically coupled to the antenna interface of the RFID semiconductorchip, and an antenna electrically coupled to the conductor. A spacer hasa first surface and an opposing second surface. The first surface of thespacer is attached to the second planar surface of the RFID tag. Thespacer has a predetermined thickness between the first surface and thesecond surface. A mounting carrier has a substantially planar body witha first portion having a first end and a second end with two sidesdefined therebetween and has one or more second portions extending fromthe body forming free ends each with a planar top surface and a planarbottom surface. Each also has a selectively attachable adhesive on aportion of the bottom surface and is deformably attached to the firstportion. The second surface of the spacer is attached to the top surfaceof the first portion with the first planar surface of the RFID tagposition parallel and set apart above the top surface of the elongatedcentral body of the carrier by a distance equal to or greater than thepredetermined thickness of the spacer.

According to still another aspect, a method of operating a radiofrequency identification (RFID) tag assembly of the immediatelypreceding paragraph includes attaching the described RFID tag assemblyto an operating surface of a piece of equipment used by an eventparticipant, the operating surface of the equipment piece having anouter surface and an inner surface and one or more openings extendingthrough the outer surface towards the inner surface and defining anintermediate surface therebetween. The method also includes orienting afirst portion of the RFID tag assembly along the outer surface of theoperating surface and folding at least one second portion along a foldline between the first portion and second portion of the RFID tagassembly. The method further includes threading the at least one secondportion of the RFID tag assembly through one of openings from the outersurface proximate towards the inner surface and selectively securing theat least one second portion of the RFID tag assembly to at least one ofthe intermediate surface and the inner surface of the operating surfaceof the piece of equipment.

Further aspects of the present disclosure will be in part apparent andin part pointed out below. It should be understood that various aspectsof the disclosure might be implemented individually or in combinationwith one another. It should also be understood that the detaileddescription and drawings, while indicating certain exemplaryembodiments, are intended for purposes of illustration only and shouldnot be construed as limiting the scope of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of an RFID tag assembly having an RFID tagaccording to a first exemplary embodiment.

FIG. 2 is top perspective view of the RFID tag assembly of FIG. 1,according to a first exemplary embodiment.

FIG. 3 is an illustration of an RFID tag assembly having an RFID tag,showing the RFID tag assembly attached to a participant's helmetaccording to another exemplary embodiment.

FIG. 4 is a side cross-sectional view of the RFID tag assemblyattachment to a participant's helmet, according to the exemplaryembodiment of FIG. 3.

FIG. 5 is a side cross-sectional view of an RFID tag assembly having afoam spacer according to yet another exemplary embodiment.

FIG. 6 is a side cross-sectional view of an RFID tag assembly having afoam spacer according to another exemplary embodiment.

FIGS. 7 and 8 are side cross-sectional views of two RFID tag assembliesmounted on a racing bib as a mounting surface and in relationship to anoperating surface according to two additional exemplary embodiments.

FIG. 9 is a top view of an RFID tag assembly illustrating the dimensionsof the RFID tag in relationship to the dimensions of the foam insertaccording to one exemplary embodiment.

FIG. 10 is a side cross-sectional view of an RFID tag assembly accordingto another exemplary embodiment.

FIG. 11 is a perspective view of an operating environment for an RFIDtag assembly for use in timing the progress of a user in a racing eventaccording to one exemplary embodiment.

FIG. 12 is a block diagram of a specialized computer system suitable forimplementing one or more assembly or methods of various embodiments asdescribed herein.

It should be understood that throughout the drawings, correspondingreference numerals indicate like or corresponding parts and features.

DETAILED DESCRIPTION

The following description is merely exemplary in nature and is notintended to limit the present disclosure or the disclosure'sapplications or uses.

Before turning to the figures and the various exemplary embodimentsillustrated therein, a detailed overview of various embodiments andaspects is provided for purposes of breadth of scope, context, clarity,and completeness.

Referring to FIG. 1, a schematic view of an RFID tag assembly 80 havingan RFID tag 11 according to a first exemplary embodiment is shown. TheRFID tag assembly 80 has a first portion 30 including an upper surface32 and a lower surface 34 and at least one second portion 36 pivotallycoupled to and having a free end extending from the first portion 30.Each second portion 36 includes an upper surface 38 and a lower surface40. The second planar surface 42 of the RFID tag 11 is fixedly attachedto the upper surface 32 of the first portion 30. Each second portion 36is selectably deformable in relation to the pivotally coupled firstportion 30. The bottom surface 40 of each second portion 36 has aselectively attachable adhesive. Any suitable adhesive can be used,including but not limited to contact cement. Typically, the adhesivewould be applied to the bottom surface 40 of each second portion 36prior to an event, and covered with a backing that would be removed whenthe RFID tag assembly 80 is mounted to the Helmet 42. However, theadhesive can be applied at the time the RFID tag assembly 80 is mountedto the Helmet 42.

The first 30 and second 34 portions of the RFID tag assembly 80 can beformed from any material of suitable strength and durability to protectthe RFID tag 11 and remain securely attached to the Helmet 42 in theevent environment and that is sufficiently flexible to allowing mountingas described herein. Potential material includes cardboard, Mylar®(Mylar is a registered trademark of DuPont Teijin Films) or otherflexible plastics and vinyl tape.

The RFID tag assembly 80 of FIG. 1 also includes an RFID tag 11 having amounting substrate 16 with an exposed first planar surface 82 and anopposing second planar surface 84. The RFID tag 11 has an RFIDsemiconductor chip 12 having a predetermined operating frequency with anantenna interface mounted on the second planar surface 84, a conductor14 electrically coupled to the antenna interface of the RFIDsemiconductor chip 12, and an antenna 18 electrically coupled to theconductor 14.

As shown in FIG. 1, the RFID tag assembly 80 is generally T-shaped, withtwo second portions 36 extending from opposite sides of one end of thefirst portion 30. One skilled in the art will appreciate that the RFIDtag assembly 80 can be formed in any shape, and any number of secondportions 36 could be used without departing from the scope of thepresent disclosure. For example, the shape of the RFID tag assembly 80can be modified to accommodate mounting on different variants of helmetsor other devices used by a participant. Further, the shape of the RFIDtag assembly 80 may serve an ornamental function, for instance toaccommodate a particular theme for an event such as a holiday orcharitable cause. Similarly, the number and placement of second portions36 can be adjusted to accommodate mounting on different variants ofhelmets or other devices used by a participant.

In FIG. 2, a top perspective view of the RFID tag assembly 80 of FIG. 1,according to a first exemplary embodiment, is illustrated. The RFID tagassembly 80 may contain desired indicia 44, such as the name of themanufacturer of the RFID tag assembly 80, a participant identifier, orinstructions for mounting the RFID tag assembly 80.

FIG. 3 illustrates an RFID tag assembly 80 having an RFID tag 11,showing the RFID tag assembly 80 attached to a participant's Helmet 42according to another exemplary embodiment. The RFID tag assembly 80 isgenerally mounted on the top of the Helmet 42, with the first portion 30running along the top of the Helmet 42 in a generally front to backdirection. One second portion 36 of the RFID tag assembly 80 is insertedthrough Helmet Vent A 46, folded along a fold line as shown in FIG. 1,and secured to an underside surface 50 of the Helmet 42 using anadhesive. Another second portion 36 is applied in a similar fashionusing Helmet Vent B 48. In this manner, the RFID tag assembly 80 issecurely attached to the Helmet 42.

FIG. 4 shows a side cross-sectional view of the RFID tag assembly 80attachment to a participant's helmet 42, according to the exemplaryembodiment of FIG. 3. The RFID tag assembly 80 including the RFID tag 11is mounted above the Helmet's upper surface. The two second portions 36are shown extending through Helmet Vent A 46 and B 48, respectively,folding around an underside surface 50 of the Helmet 42. The two secondportions 36 are secured to underside surface 50 of the Helmet 42 usingan adhesive.

In another embodiment, an RFID tag assembly 80 for use in tracking ortiming of a progress of a user includes an RFID tag 11 having a mountingsubstrate 16 with an exposed first planar surface 15 and an opposingsecond planar surface 17. At least one of the first 15 and second 17planar surfaces is adapted for selective attachment to a carriersurface. The RFID tag 11 has an RFID semiconductor chip 12 that is anytype of RFID chip and can have a predetermined operating frequency andan antenna interface mounted on the at least one of the first 15 andsecond 18 planar surfaces. A conductor 14 is electrically orconductively coupled to the antenna interface of the RFID semiconductorchip 12 and an antenna 18 is electrically coupled to the conductor. Asshown, the antenna 18 can be a bipolar foil antenna. The RFIDsemiconductor chip 12 and the conductor 14 can each be formed on themounting surface of the mounting substrate 16. Similarly, the antenna 18can be formed on one of the surfaces 15, 17 of the mounting substrate 16as a foil antenna. The mounting substrate 16 can be any suitablemounting material including a polyester (PET) film.

A spacer 62 composed of a foam material is attached to the second planarsurface 17. The foam material is composed of a material that isnon-conducting and non-absorbing of a substantial amount of energy atthe predetermined operating frequency. The spacer 62 can be positionedfor placement between a surface of the body of the user and the RFID tag11 for positioning at a minimum spaced apart distance from the surfaceof the body of the user during operation of the RFID tag assembly 80.The spacer can be attached to the first 15 or second planar surface 17of the mounting substrate 16 by an adhesive material or as otherwisesuitable for the application. The spacer 62 can be dimensioned to have aspaced apart distance between the operating surface of the body of theuser and the mounting substrate 16 that is greater than or equal toabout ¼ of a wavelength of the predetermined operating frequency. Forexample, in one exemplary embodiment the spacer 62 is dimensioned tohave a spaced apart distance between a surface of the user body and themounting substrate 16 of between about 0.125 inches and about 0.5inches.

The mounting substrate 16 of the RFID tag assembly 80 can be asubstantially planar mounting substrate having a length, a width and athickness. The thickness of the mounting substrate 16 can be thedistance between the first planar surface 15 and the opposing secondplanar surface 17. The length of the spacer 62 can be a length and widththat is substantially equal to or greater than the length and width ofthe RFID tag assembly mounting substrate 16, respectively. As such, thespacer 62 can encircle or enclose the mounting substrate 16. An exampleof an RFID tag assembly 80 is shown in FIG. 9. As shown, the length ofthe spacer LSP is greater than the length of the mounting substrate LMSand the height of the spacer HSP is greater than the height of themounting substrate HMS.

The assembly can also include a mounting body having the carrier surfacethereon. The carrier surface can be composed of a non-permeable materialand the at least one planar surface is attached to the carrier surface.In such embodiments, the spacer can also be composed of a waterproofnon-permeable foam material, such as a high density foam material and/orone having a closed cell structure. As such, the attached spacer andattached carrier surface can provide a substantially moisture proofsealing of the RFID tag assembly from external foreign substances andmoisture. The sizing of the spacer and the carrier surface can ensurethat the RFID tag assembly is completely enclosed and protected. Forexample, a helmet is provided as a mounting body for selectiveattachment of the RFID tag assembly to a participant.

In another embodiment, a method of operating a radio frequencyidentification (RFID) tag assembly includes mounting a mountingsubstrate with an RFID semiconductor chip at a spaced apart distancefrom an operating surface at a distance greater than or equal to about ¼of a wavelength of a predetermined operating frequency of a radiofrequency energy. The operating surface being a surface associated witha body composed of a material that absorbs a substantial amount ofenergy at the predetermined operating frequency. The method alsoincludes receiving at a first side of a two sided planar antenna coupledto an RFID semiconductor chip mounted in proximity to the operatingsurface a first portion of that radio frequency energy as transmittedfrom an antenna associated with a base station transceiver positionedremote from the RFID tag assembly. The first side is oriented away fromthe operating surface. The method further includes receiving at a secondside of the two-sided planar antenna a second portion of the radiofrequency energy transmitted from the base station transceiver antenna.The second portion of the radio frequency energy is received at thepredetermined operating frequency. The second side is oriented towardsthe operating surface. The method also includes processing the receivedfirst and second portions of the radio frequency energy by the RFIDsemiconductor chip. The method further includes generating a reply radiofrequency energy at the RFID semiconductor chip at a predetermined replyoperating frequency in response to the processing and in response to thefirst and second received radio frequency energy portions. The methodincludes radiating the reply radio frequency energy by both the firstside and the second side of the two-sided planar antenna.

Referring to the two exemplary embodiments illustrated in FIGS. 5 and10, an RFID tag assembly 80 includes an RFID tag 11 includes an RFIDsemiconductor chip 12 with an antenna interface (not shown), a conductor14 and a bipolar antenna 18, which is shown as two first radiatingelements 20, and a mounting substrate 16 that has a first surface 82 anda second surface 84. The RFID semiconductor chip 12, conductor 14 andtwo first radiating elements 20 are each mounted on the second surface84. A foam spacer 62 is attached to the second surface 15 and about themounted RFID semiconductor chip 12, conductor 14, and two firstradiating elements 20. The spacer 62 can have a thickness such as aminimum thickness of d_(min) such that the spacer spaces the two firstradiating elements 20 apart from the surface plane PS of an operatingsurface 24. However, in some embodiments, d_(min) can be the sum of thethickness of the spacer, and any other expected nonconductive materialthat is expected to be present between the first plane P1 containing thefirst radiating elements and the operating surface. As such, thethickness of the spacer can be less than the ¼ wavelength or the totald_(min) in some embodiments.

In operation, as illustrated by example in FIG. 6, operating energy EOPis propagated between a transceiver antenna AR1 and one or both of thefirst radiating elements 20. As shown in this embodiment, there is nocarrier or attachment surface. This includes direct propagated energy EDand indirect propagated energy EIN. As shown, the amount of indirectpropagated energy EIN can be enhanced by dimensioning of the spacerthickness d_(min). This can also include reducing the absorption of theindirect propagated energy EIN by the spaced apart positioning caused bythe spacer thereby limiting the negative effect of energy absorption bythe operating surface 24.

In another embodiment, as shown in FIG. 7, the RFID tag assembly 10 isattached to a carrier 86 that has a front planar surface 89 and anopposing carrier surface 87. The RFID tag assembly 10 is attached by anadhesive (not shown) that is one the first surface 17 of the mountingsubstrate 16 that is opposite of the second surface 15 on which the RFIDtag assembly components are mounted. The spacer 62 is attached as in theembodiment of FIG. 6 and has an outer surface 88 that is positioned forengagement against the operating surface 24 for ensuring that theminimum distance d_(min) is maintained during operation.

FIG. 8 illustrates another embodiment where with the carrier 86 beingpositioned between the RFID tag assembly 10 and the operating surface24. In this embodiment, the spacer 62 is attached similarly to thatdescribed in FIGS. 5 and 6; however, the outer surface of the spacer 62is attached to the outer surface 89 of the carrier 86 rather than theopposing carrier surface 87. In this manner, the thickness of thecarrier and the thickness of the spacer 62 combine to provide forensuring the minimum distance d_(min) is maintained.

FIG. 11 is a perspective view of an operating environment for an RFIDtag assembly 80 such as for timing the progress of a user in a racingevent using a racing bib 90 as illustrated in FIG. 15A or 15B, by way ofexamples. As shown, the racing bib 90 is worn by the user whom isrunning along track 102 and approaching timing point 104. Timing point104 may be any timing point and can include a finish line of track 102.Transceiver antenna A_(R1) and A_(R2) are mounted proximate to thetiming point 104 for exchanging operating energy E_(OP) with the RFIDtag assembly 80 mounted on the bib 90.

Referring to FIG. 12, an operating environment for an illustratedembodiment of the an RFID semiconductor chip and/or remote transceiveris a computer system 300 with a computer 302 that comprises at least onehigh speed processing unit (CPU) 304, in conjunction with a memorysystem 306 interconnected with at least one bus structure 308, an inputdevice 310, and an output device 312. These elements are interconnectedby at least one bus structure 308. As addressed above, the input andoutput devices can include a communication interface including anantenna interface.

The illustrated CPU 304 for an RFID semiconductor chip is of familiardesign and includes an arithmetic logic unit (ALU) 314 for performingcomputations, a collection of registers for temporary storage of dataand instructions, and a control unit 316 for controlling operation ofthe computer system 300. Any of a variety of processors, including atleast those from Digital Equipment, Sun, MIPS, Motorola, NEC, Intel,Cyrix, AMD, HP, and Nexgen, is equally preferred but not limitedthereto, for the CPU 304. The illustrated embodiment operates on anoperating system designed to be portable to any of these processingplatforms.

The memory system 306 generally includes high-speed main memory 320 inthe form of a medium such as random access memory (RAM) and read onlymemory (ROM) semiconductor devices that are typical on an RFIDsemiconductor chip. However, the present disclosure is not limitedthereto and can include secondary storage 322 in the form of long termstorage mediums such as RAM or flash memory, and other devices thatstore data using electrical, magnetic, and optical or other recordingmedia. The main memory 320 also can include, in some embodiments, avideo display memory for displaying images through a display device (notshown). Those skilled in the art will recognize that the memory system306 can comprise a variety of alternative components having a variety ofstorage capacities.

Where applicable, while not typically provided on RFID tags or chips, aninput device 310, and output device 312 can also be provided. The inputdevice 310 can comprise any keyboard, mouse, physical transducer (e.g. amicrophone), and can be interconnected to the computer 302 via an inputinterface 324 associated with the above described communicationinterface including the antenna interface. The output device 312 caninclude a display, a printer, a transducer (e.g. a speaker), etc., andbe interconnected to the computer 302 via an output interface 326 thatcan include the above described communication interface including theantenna interface. Some devices, such as a network adapter or a modem,can be used as input and/or output devices.

As is familiar to those skilled in the art, the computer system 300further includes an operating system and at least one applicationprogram. The operating system is the set of software that controls thecomputer system's operation and the allocation of resources. Theapplication program is the set of software that performs a task desiredby the user, using computer resources made available through theoperating system. Both are typically resident in the illustrated memorysystem 306 that may be resident on the RFID semiconductor chip.

In accordance with the practices of persons skilled in the art ofcomputer programming, portions of the present disclosure as describedherein are made with reference to symbolic representations ofoperations, processes or methods that are performed by the computersystem 300. Such operations are commonly referred to as being“computer-executed.” One of ordinary skill in the art will appreciatehaving reviewed this disclosure that one or more of the operations canbe symbolically represented to include the manipulation by the CPU 304of electrical signals representing data bits and the maintenance of databits at memory locations in the memory system 306, as well as otherprocessing of signals. The memory locations where data bits aremaintained are physical locations that have particular electrical,magnetic, or optical properties corresponding to the data bits. One ormore portions or functions of the RFID timing chip as disclosed hereincan be implemented in a program or programs, comprising a series ofinstructions stored on a computer-readable medium. The computer-readablemedium can be any of the devices, or a combination of the devices,described above in connection with the memory system 306.

When describing elements or features and/or embodiments thereof, thearticles “a”, “an”, “the”, and “said” are intended to mean that thereare one or more of the elements or features. The terms “comprising”,“including”, and “having” are intended to be inclusive and mean thatthere may be additional elements or features beyond those specificallydescribed.

Those skilled in the art will recognize that various changes can be madeto the exemplary embodiments and implementations described above withoutdeparting from the scope of the disclosure. Accordingly, all mattercontained in the above description or shown in the accompanying drawingsshould be interpreted as illustrative and not in a limiting sense.

It is further to be understood that the processes or steps describedherein are not to be construed as necessarily requiring theirperformance in the particular order discussed or illustrated. It is alsoto be understood that additional or alternative processes or steps maybe employed.

What is claimed is:
 1. An RFID tag assembly for use in tracking ortiming of a progress of a user wearing a helmet comprising: an RFID taghaving a mounting substrate with an exposed first planar surface and anopposing second planar surface, the RFID tag having an RFIDsemiconductor chip having a predetermined operating frequency with anantenna interface mounted on the second planar surface, a conductorelectrically coupled to the antenna interface of the RFID semiconductorchip, and an antenna electrically coupled to the conductor; a mountingcarrier for attachment to an outer portion of the helmet, the mountingcarrier having a first portion having an upper surface and a lowersurface and at least one second portion pivotally coupled to the firstportion and having a free end extending from the first portion with anupper surface and a lower surface, the second planar surface of the RFIDtag being fixedly attached to the upper surface of the first portion,each second portion being selectably deformable in relation to thepivotally coupled first portion and having a selectively attachableadhesive on the bottom surface of at least a portion of the extendingsecond portion; and a spacer having a first surface and an opposingsecond surface and having a predetermined thickness between the firstsurface and the second surface, wherein the second planar surface of theRFID tag is fixedly attached via the first surface of the spacer beingattached to the second planar surface of the RFID tag and the secondsurface of the spacer being attached to the upper surface of the firstportion of the mounting carrier.
 2. The assembly of claim 1 wherein thespacer is composed of a foam material that is non-conducting andnon-absorbing of a substantial amount of energy at the predeterminedoperating frequency.
 3. The assembly of claim 1 wherein the mountingcarrier has two second portions extending from opposing sides of thefirst portion.
 4. The assembly of claim 3 wherein the first portion hasan elongated body.
 5. The assembly of claim 4 wherein the mountingcarrier has two second portions extending from opposing sides of thefirst portion.
 6. The assembly of claim 5 wherein the first portion hasa first end and second end and the two second portions are positioned onopposing sides defined between the first end and the second end.
 7. Theassembly of claim 6 wherein the two opposing sides are positionedproximate to at least one of the first end and the second end of thefirst portion.
 8. The assembly of claim 1 wherein the first portion hasan elongated body with two opposing ends and two sides defined betweenthe two ends, and at least one of the second portions extends outwardlyfrom one of the two ends.
 9. The assembly of claim 1 wherein the RFIDtag includes a unique RFID tag number and at least one of the firstplanar surface of the RFID tag and the upper surface of the mountingcarrier includes indicia including a unique identification numbercorresponding to the RFID tag number.
 10. The assembly of claim 1wherein the lower surface of the mounting carrier includes an adhesivefixedly attaching the RFID tag to the upper surface of the firstportion.
 11. The assembly of claim 1 wherein the antenna is a bipolarfoil antenna formed on one of the surfaces of the mounting substratecomposed of a polyester (PET) film and the RFID semiconductor chip is apassive RFID chip and wherein the conductor is formed on the secondplanar surface of the mounting substrate.
 12. The assembly of claim 1wherein the predetermined operating frequency of the RFID chip is afrequency within a UHF frequency band and the spacer is dimensioned tohave the predetermined thickness of greater than or equal to about ¼ ofa wavelength of the predetermined operating frequency.
 13. The assemblyof claim 1 wherein the spacer is composed of a high density closed cellfoam material and has a predetermined thickness dimensioned to space theantenna of the RFID tag apart from the outer portion of the helmet onwhich the mounting carrier is attached by between about 0.125 inches andabout 0.5 inches.
 14. An RFID tag assembly for use in tracking or timingof a progress of a participant wearing a helmet comprising: an RFID taghaving a mounting substrate with an exposed first planar surface and anopposing second planar surface, the RFID tag having an RFIDsemiconductor chip having a predetermined operating frequency with anantenna interface mounted on the second planar surface, a conductorelectrically coupled to the antenna interface of the RFID semiconductorchip, and an antenna electrically coupled to the conductor; a spacerhaving a first surface and an opposing second surface, the first surfaceof the spacer being attached to the second planar surface of the RFIDtag, the spacer having a predetermined thickness between the firstsurface and the second surface; and a mounting carrier with asubstantially planar body with a first portion having a first end and asecond end with two sides defined therebetween and having one or moresecond portions extending from the body forming free ends and eachhaving a planar top surface and a planar bottom surface and aselectively attachable adhesive on at least a portion of the bottomsurface, and wherein each second portion is deformably attached to thefirst portion, the second surface of the spacer being attached to thetop surface of the first portion with the first planar surface of theRFID tag position parallel and set apart above the top surface of theelongated central body of the carrier by a distance equal to or greaterthan the predetermined thickness of the spacer.
 15. The assembly ofclaim 14 wherein the mounting carrier has a substantially planar bodyforming a T-shape.
 16. The assembly of claim 14 wherein the spacer iscomposed of a foam material that is non-conducting and non-absorbing ofa substantial amount of energy at the predetermined operating frequency.17. The assembly of claim 14 wherein the mounting carrier has two secondportions extending from opposing sides of the first portion.
 18. Theassembly of claim 17 wherein the first portion of the mounting carrierhas an elongated body and has two second portions extending fromopposing sides of the first portion.
 19. The assembly of claim 18wherein the first portion has a first end and second end and the twosecond portions are positioned on opposing sides defined between thefirst end and the second end.
 20. The assembly of claim 17 wherein thetwo opposing sides are positioned proximate to at least one of the firstend and the second end.
 21. The assembly of claim 14 wherein the firstportion has an elongated body with two opposing ends and to sidesdefined between the two ends, and at least one of the second portionsextends outwardly from one of the two ends.
 22. The assembly of claim 14wherein the RFID tag includes a unique RFID tag number and at least oneof the first planar surface of the RFID tag and the upper surface of themounting carrier includes indicia having a unique identification numbercorresponding to the RFID tag number.
 23. The assembly of claim 14wherein the lower surface of the mounting carrier having includes aselectively attachable adhesive.
 24. The assembly of claim 14 whereinthe antenna is a bipolar foil antenna formed on one of the surfaces ofthe mounting substrate formed from polyester (PET) film and a passiveRFID semiconductor chip and conductor are formed on the mounting surfaceof the mounting substrate.
 25. The assembly of claim 14 wherein thepredetermined operating frequency of the RFID chip is a frequency withina UHF frequency band and the spacer is dimensioned to have thepredetermined thickness of greater than or equal to about ¼ of awavelength of the predetermined operating frequency.
 26. The assembly ofclaim 14 wherein the spacer has a predetermined thickness dimensioned tospace the antenna of the RFID tag apart from the outer portion of thehelmet on which the mounting carrier is attached by between about 0.125inches and about 0.5 inches.
 27. The assembly of claim 14 wherein themounting substrate of the RFID tag assembly is substantially planarhaving a length, a width and a thickness, the thickness being defined bythe distance between the first planar surface and the opposing secondplanar surface, and wherein the spacer has a length and widthsubstantially equal to or greater than the length and width of the RFIDtag assembly mounting substrate, respectively.
 28. The assembly of theclaim 14 wherein the spacer wherein the spacer is composed of a highdensity closed cell foam material and is attached to the second planarsurface of the mounting substrate by an adhesive material.
 29. Theassembly of claim 14, further comprising a mounting body having thecarrier surface thereon, the carrier surface being composed of anon-permeable material and the at least one planar surface is attachedto the carrier surface; the spacer being composed of a waterproofnon-permeable foam material, said attached spacer and attached carriersurface providing a sealing of the RFID tag assembly from externalforeign substances and moisture.
 30. A method of operating a radiofrequency identification (RFID) tag assembly comprising: attaching anRFID tag assembly as defined by claim 1 to an operating surface of apiece of equipment used by an event participant, the operating surfaceof the equipment piece having an outer surface and an inner surface andone or more openings extending through the outer surface towards theinner surface and defining an intermediate surface therebetween;orienting a first portion of the RFID tag assembly along the outersurface of the operating surface; folding at least one second portionalong a fold line between the first portion and second portion of theRFID tag assembly; threading the at least one second portion of the RFIDtag assembly through one of openings from the outer surface proximatetowards the inner surface; and selectively securing the at least onesecond portion of the RFID tag assembly to at least one of theintermediate surface and the inner surface of the operating surface ofthe piece of equipment.
 31. A method of operating a radio frequencyidentification (RFID) tag assembly comprising: attaching an RFID tagassembly as defined by claim 14 to an operating surface of a piece ofequipment used by an event participant, the operating surface of theequipment piece having an outer surface and an inner surface and one ormore openings extending through the outer surface towards the innersurface and defining an intermediate surface therebetween; orienting afirst portion of the RFID tag assembly along the outer surface of theoperating surface; folding at least one second portion along a fold linebetween the first portion and second portion of the RFID tag assembly;threading the at least one second portion of the RFID tag assemblythrough one of openings from the outer surface proximate towards theinner surface; and selectively securing the at least one second portionof the RFID tag assembly to at least one of the intermediate surface andthe inner surface of the operating surface of the piece of equipment.